GTS100BH-N（平面式高速固晶机）
（周期：50ms）
适用于SMD020，1010，2121，2835，灯丝，COB等
一、机型特性
1.采用国际领先的双固晶，双点胶，双晶片搜寻系统；
2.采用直驱电机驱动邦头
3.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）
4.采用可程式恒温点胶系统；
5.采用真空漏晶检测；
6.采用自动式上下料系统，减少换料时间；
7. 工控机控制设备运行，简化了自动化设备的操作；
8.精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
9. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障。
GTS100BH-N
Plane-type High-speed Die Bonder
Cycle: 50ms
It is compatible with SMD020, 1010, 2121, 2835, lamp filament, and COB etc.
Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Programmed control constant-temperature adhesive dispensing system is also applied;
5. Vacuum die missing testing technology is adopted;
6. Automatic loading and unloading system is applied to saving the time of reloading;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
